| Stencil Size Range (鋼板尺寸) |
L 650 mm × W 550 mm |
| Min. IC Pitch (IC最小腳距) |
0.30 mm |
| Max. PCB Size (PCB最大尺寸) |
L 500 mm × W 250 mm |
| Min. Chip Size (Chip 最小尺寸) |
0402(1mm ×0.5 mm) |
| Max. Camera Size (鏡頭最大尺寸) |
45 mm × 45 mm |
| Min. BGA Ball Pitch (BGA最小球距尺寸) |
0.80 mm (Min) |
| Min. BGA Ball Diameter (BGA最小球徑尺寸) |
0.40 mm (Min) |
| Min. QFP Lead Pitch (QFP最小腳距尺寸) |
0.38 mm (Min) |
| Frequency of Stencil Cleaning (鋼板擦拭頻率) |
1 time / 10 ~ 20 Pieces |
| Accuracy for YV100II (貼片精度) |
Within +/-0.1mm/chip ; +/-0.08mm/QFP |
| Accuracy for YVL88II (貼片精度) |
Within +/-0.08mm/chip ; +/-0.04mm/QFP |
SMD LINE A (2+1) :
速度(Speed) : 0.25 SEC/CHIP + 0.25 SEC/CHIP + 0.45 SEC/CHIP
