Speed : 0.25 SEC/CHIP + 0.25 SEC/CHIP + 0.45 SEC/CHIP Capacity : 9000 CPH/hr + 9000 CPH/hr + 5000 CPH/hr Monthly capacity : 16,560,000 CPH/M CPH= number of components placed for one hour
SMD LINE B (2) :
Speed : 0.25 SEC/CHIP + 0.25 SEC/CHIP Capacity : 9000 CPH/hr + 9000 CPH/hr Monthly capacity : 12,960,000 CPH/M CPH= number of components placed for one hour
SMD Capacity :
Stencil Size Range
L 650 mm × W 550 mm
Min. IC Pitch
0.30 mm
Max. PCB Size
L 500 mm × W 250 mm
Min. Chip Size
0402(1mm ×0.5 mm)
Max. Camera Size
45 mm × 45 mm
Min. BGA Ball Pitch
0.80 mm (Min)
Min. BGA Ball Diameter
0.40 mm (Min)
Min. QFP Lead Pitch
0.38 mm (Min)
Frequency of Stencil Cleaning
1 time / 10 ~ 20 Pieces
Accuracy for YV100II
Within +/-0.1mm/chip ; +/-0.08mm/QFP
Accuracy for YVL88II
Within +/-0.08mm/chip ; +/-0.04mm/QFP
TEL：886-2-2901-4625 FAX：886-2-2903-3216
No.17, Lane 134, Shoushan Rd.Taishan Dist., New Taipei City 24392 Taiwan (R.O.C.)
c 2010 Angel Electronics Co.,Ltd All rights reserved.
SMD LINE A (2+1) :
Speed : 0.25 SEC/CHIP + 0.25 SEC/CHIP + 0.45 SEC/CHIP
